Call for Papers now Open for 2015 National Technical Forums 


All interested parties are now invited to submit an abstract under the theme Open Innovation & Collaboration for the 2015 National Technical Forums which will be held in conjunction with AUSPACK on the 24th to 26th March.

The Australian Institute of Packaging (AIP) and the Australian Packaging & Processing Machinery Association (APPMA) are currently at the planning stage of the 2015 National Technical Forums that will be held as a part of Packaging & Processing Week at the Melbourne Convention and Exhibition Centre on the 24th to the 26th of March 2015. Following a number of highly successful National Technical Forums over the last six AUSPACK exhibitions, the 2015 National Technical Forum will be designed to deliver a three-day educational program that will cover a broad range of topics relating to the theme Open Innovation & Collaboration.
The 2015 Packaging & Processing Week National Technical Forums will attract delegates from all facets of the packaging and processing industry of both technologist and management levels (such as design, development, marketing, production, engineering, supply chain and logistics personnel) to equipment suppliers, raw material providers, users of packaging, retailers and consumers.
A list of topic areas are available for your consideration. These topics should be considered from the point of view of technical, environmental and consumer issues. This list is not limiting and any additional ideas would be welcomed. The AIP and the APPMA intend to break the National Technical Forums into breakout sessions, to ensure that a diverse range of issues and topics are covered over the three days. The AIP and the APPMA are looking for a broad range of speakers from all areas of the packaging, processing, materials and component sectors to ensure that the National Technical Forums offer something for everyone.

To access the 2015 National Technical Forum Call for Papers simply email [email protected]




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