News 

Deep Dive: BOUND METAL DEPOSITION 

#

What is Bound Metal Deposition (BMD)?

Bound Metal Deposition™ (BMD) is an extrusion-based metal additive manufacturing (AM) process where metal components are constructed by extrusion of a powder-filled thermoplastic media. Bound metal rods—metal powder held together by wax and polymer binder—are heated and extruded onto the build plate, shaping a part layer-by-layer. Once printed, the binder is removed via the debind process, and then sintered—causing the metal particles to densify.

Prevalent metal AM technologies involve melting powder or wire feedstock using lasers or electron beams. While viable, these systems have substantial facilities requirements to accommodate power and safety requirements. Additionally, localized melting and rapid solidification create complex stress fields within parts, requiring rigid support structures to aid heat dissipation and resist shrinkage. As a result, support removal often requires machining.

The new Desktop Metal Studio System™ leverages BMD to deliver an office-friendly metal 3D printing solution. There are no loose powders or lasers associated with fabrication. In terms of support removal, parts are printed with their supports which are separated by ceramic interface media (or the Ceramic Release Layer™) that does not bond to the metal. This material disintegrates during sintering, making it easy to remove supports by hand.

For more information, contact Objective 3D

 



Hits 172